高k埋氧化物无结晶体管的DIBL抗扰性

M. Ehteshamuddin, S. Loan, M. Rafat
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引用次数: 0

摘要

在本文中,我们重点研究了与高k BOX (HB-JLT)替代传统SiO2 BOX JLT的无结晶体管(JLT)相关的漏极诱导势垒降低(DIBL)。在HB-JLT中,使用高k介电介质BOX可以使p+接平面和超薄Si膜层之间更好地耦合,从而在off状态下减少体积损耗,并具有DIBL抗干扰的优势。通过校准模拟验证,即使在通道长度为10 nm时,BOX介质介电常数的增加也完全最小化了DIBL效应,特别是对于HfO2和La2O3作为具有改善离子/ ioff比的BOX材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Excellent DIBL Immunity in Junctionless Transistor on a High-$k$ Buried Oxide
In this paper, we focus on the study of drain-induced barrier lowering (DIBL) related to junctionless transistor (JLT) with high-k BOX (HB-JLT) instead of a conventional SiO2 BOX JLT. In a HB-JLT, the use of high-k dielectric BOX results in better coupling between the p+ground plane and ultathin Si film layer resulting in volume depletion in OFF-state and has added advantage of DIBL immunity. It has been verified with calibrated simulations that the increase in permittivity of the BOX dielectric completely minimizes the DIBL effect even at a channel length of 10 nm, specifically for HfO2 and La2O3 as BOX material with improved ION/IOFFratio.
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