Wu Mengxue, Z. Lei, Liu Jiahui, H. Younan, Li Xiaomin
{"title":"磷深度剖面测量中InP衬底与硅衬底交叉污染的研究","authors":"Wu Mengxue, Z. Lei, Liu Jiahui, H. Younan, Li Xiaomin","doi":"10.1109/IPFA47161.2019.8984763","DOIUrl":null,"url":null,"abstract":"The dopant detection limit of SIMS instrument is a critical factor in semiconductor implant process monitoring and control. However, after various substrates are tested in the chamber, possible cross-contamination may lead to change of the detection limit, resulting in the inaccurate measurements and conclusions. In this paper, the cross-contamination effect is simulated with Phosphorus contaminant sputtered over the SIMS chamber. The degree of the cross-contamination is quantified and correlated with the detection limits. One of the failure cases is schematically illustrated and studied.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study of cross contamination between InP substrate and Silicon substrate during Phosphorus depth profile measurement\",\"authors\":\"Wu Mengxue, Z. Lei, Liu Jiahui, H. Younan, Li Xiaomin\",\"doi\":\"10.1109/IPFA47161.2019.8984763\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The dopant detection limit of SIMS instrument is a critical factor in semiconductor implant process monitoring and control. However, after various substrates are tested in the chamber, possible cross-contamination may lead to change of the detection limit, resulting in the inaccurate measurements and conclusions. In this paper, the cross-contamination effect is simulated with Phosphorus contaminant sputtered over the SIMS chamber. The degree of the cross-contamination is quantified and correlated with the detection limits. One of the failure cases is schematically illustrated and studied.\",\"PeriodicalId\":169775,\"journal\":{\"name\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA47161.2019.8984763\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984763","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study of cross contamination between InP substrate and Silicon substrate during Phosphorus depth profile measurement
The dopant detection limit of SIMS instrument is a critical factor in semiconductor implant process monitoring and control. However, after various substrates are tested in the chamber, possible cross-contamination may lead to change of the detection limit, resulting in the inaccurate measurements and conclusions. In this paper, the cross-contamination effect is simulated with Phosphorus contaminant sputtered over the SIMS chamber. The degree of the cross-contamination is quantified and correlated with the detection limits. One of the failure cases is schematically illustrated and studied.