用蒙特卡罗方法研究了新型正交应变硅材料中的电子输运性质

Xin Wang, D. Kencke, K.C. Liu, A. Tasch, L. Register, S. Banerjee
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引用次数: 6

摘要

本文首次用密度泛函理论和蒙特卡罗模拟研究了简单正交应变硅的电子输运性质。由于正交应变的作用,体硅X点附近的6个简并谷分解成3对能量最小值不同的简并谷。简并提升导致电子在低电场和中电场下在这些谷中重新分布。因此,在与最低谷长轴横向的电场作用下,漂移速度得到增强。在Si-Si/sub 0.6/Ge/sub 0.4/侧壁上生长的简单正交应变Si具有低场迁移率,几乎是体Si的两倍,电子饱和速度高出约20%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electron transport properties in novel orthorhombically-strained silicon material explored by the Monte Carlo method
We report for the first time on the electron transport properties of simple orthorhombically-strained silicon studied by density-functional theory and Monte Carlo simulation. The six degenerate valleys near X points in bulk silicon break into three pairs with different energy minima due to the orthorhombic strain. The degeneracy lifting causes electron redistribution among these valleys at low and intermediate electric fields. Thus the drift velocity is enhanced under an electric field transverse to the long-axis of the lowest valleys. The simple orthorhombically-strained Si grown on a Si-Si/sub 0.6/Ge/sub 0.4/ sidewall has a low-field mobility almost twice that of bulk Si and an electron saturation velocity approximately 20% higher.
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