{"title":"一种低延迟、高带宽的以太网交换芯片","authors":"U. Cummings","doi":"10.1109/HOTCHIPS.2006.7477870","DOIUrl":null,"url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation on a low latency, high bandwidth Ethernet switch chip from Fulcrum. Some of the specific topics discussed include: an overview of Fulcrum and its major product line; the special features of Ethernet switch chips; data center interconnect requirements; applicatinos for using this chip product line; latency testing and performance output; and various performance evaluations from processing outputs.","PeriodicalId":302249,"journal":{"name":"2006 IEEE Hot Chips 18 Symposium (HCS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A low-latency, high-bandwidth ethernet switch chip\",\"authors\":\"U. Cummings\",\"doi\":\"10.1109/HOTCHIPS.2006.7477870\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article consists of a collection of slides from the author's conference presentation on a low latency, high bandwidth Ethernet switch chip from Fulcrum. Some of the specific topics discussed include: an overview of Fulcrum and its major product line; the special features of Ethernet switch chips; data center interconnect requirements; applicatinos for using this chip product line; latency testing and performance output; and various performance evaluations from processing outputs.\",\"PeriodicalId\":302249,\"journal\":{\"name\":\"2006 IEEE Hot Chips 18 Symposium (HCS)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE Hot Chips 18 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2006.7477870\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE Hot Chips 18 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2006.7477870","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A low-latency, high-bandwidth ethernet switch chip
This article consists of a collection of slides from the author's conference presentation on a low latency, high bandwidth Ethernet switch chip from Fulcrum. Some of the specific topics discussed include: an overview of Fulcrum and its major product line; the special features of Ethernet switch chips; data center interconnect requirements; applicatinos for using this chip product line; latency testing and performance output; and various performance evaluations from processing outputs.