利用良率管理测试结构减少缺陷

International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM Pub Date : 1994-06-21 DOI:10.1109/ISSM.1994.729442

H.M. Chou, C.C. Liu, C.J. Kuo, J.H. Hwang, N.W. Wu, M.C. Chang

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引用次数: 0

摘要

综述了成品率管理测试模式在存储产品上的设计与应用。对Y.M.模式和传统的T.K.模式进行了评估，根据它们忠实地指出工艺偏差/缺陷和预测CP产量的能力。根据先前的标准，Y.M.模式优于T.K.模式。最后，还将讨论设计指南。

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Defect Reduction Using Yield Management Test Structures

Design and applications of Yield Management test patterns on memory products have been reviewed. Evaluations are made for Y.M. patterns and conventional T.K. patterns in terms of their ability to faithfully point out process deviations/defects and to predict CP yield. It s assessed that Y.M. patterns are superior to T.K. patterns in terms of the previous criteria. Finally, design guidelines will be also discussed.

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International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM

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