混合红外成像阵列

A. M. Andrews
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引用次数: 5

摘要

本征半导体的红外焦平面在工作温度和量子效率方面都优于外征半导体。目前对混合焦平面的研究主要集中在检测发生在本征窄能带隙半导体中,信号处理在与探测器阵列电接口的硅多路复用器中完成。目前正在开发两种主要的混合装置设计来感知入射光子通量:正面和背面照明配置。描述了这些混合设计和使用III-V, IV-VI和II-VI合金系统的方法。此外,还将介绍包含自频谱滤波和检测器-多路复用接口电路的器件。讨论了现有焦平面的工作原理和实现实用、高性能混合焦平面的关键技术问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hybrid infrared imaging arrays
Infrared focal planes in intrinsic semiconductors offer advantages over extrinsic semiconductors in both operating temperature and quantum efficiency. Current research on hybrid focal planes is directed toward devices in which detection occurs in an intrinsic narrow energy bandgap semiconductor, and signal processing is accomplished in a silicon multiplexer which is electrically interfaced to the detector array. Two principal hybrid device designs are being developed to sense the incident photon flux: frontside and backside illuminated configurations. These hybrid designs and the approaches using III-V, IV-VI and II-VI alloy systems are described. Furthermore, the devices which incorporate self spectral filtering and detector-multiplexer interface circuits will be described. The operation of existing focal planes and the key technical problems associated with the attainment of practical, high performance hybrid focal planes will be discussed.
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