IMB-CNM中iLGAD传感器的技术进展

A. Doblas, D. Flores, S. Hidalgo, G. Pellegrini, D. Quirion, I. Vila
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引用次数: 0

摘要

在这篇文章中,我们将介绍IMB-CNM制造用于像素化探测器的逆低增益雪崩探测器(iLGAD)的技术发展现状。这种iLGAD传感器概念是最有前途的技术之一,可以实现需要精确位置和时间分辨率的未来4D跟踪范例。在iLGAD概念中,基于LGAD技术,读出在欧姆接点完成,允许连续的未分段乘法结。这种结构在所有有源传感器区域提供均匀增益。该概念已在第一代300 μm厚iLGAD传感器中成功验证。在第二代中,我们制造了厚iLGAD传感器,优化了x射线照射的外围。目前,我们正在开发第三代基于50 μm厚像素化ilgad的定时检测优化,外围设计能够承受高电场和更简单的单面制造工艺。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Technology Developments on iLGAD Sensors at IMB-CNM
In this contribution, we will present the status of the technological developments at IMB-CNM to fabricate Inverse Low Gain Avalanche Detectors (iLGAD) for pixelated detectors. This iLGAD sensor concept is one of the most promising technologies for enabling the future 4D tracking paradigm that requires both precise position and timing resolution. In the iLGAD concept, based on the LGAD technology, the readout is done at the ohmic contacts, allowing for a continuous unsegmented multiplication junction. This architecture provides a uniform gain over all the active sensor area. This concept was successfully demonstrated in a first generation of 300 μm thick iLGAD sensors. In the second generation, we have fabricated thick iLGAD sensor optimizing the periphery for X-Ray irradiations. Currently, we are developing a third generation based on 50 μm thick pixelated iLGADs optimized for timing detection, with a periphery design able to sustain high electric fields and a simpler single-side manufacturing process.
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