基于cmos兼容薄膜SOI的SiGe hbt高温性能评估

M. Bellini, J. Cressler, Jin Cai
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引用次数: 7

摘要

我们首次定量评估了在薄膜SOI上制造的SiGe hbt用于新兴高温电路应用的能力。完全耗尽和部分耗尽的SiGe HBTs-on-SOI的直流和交流性能被测量到330摄氏度(直流)和200摄氏度(交流)的温度。报告了Gummel特性、电流增益和输出特性。M-l用于研究集电极掺杂如何影响器件在高温下的行为。我们证明,尽管高温操作条件苛刻,SiGe HBTs-on-SOI在200-300℃范围内的许多应用中仍保持足够的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Assessing the High-Temperature Capabilities of SiGe HBTs Fabricated on CMOS-compatible Thin-film SOI
We quantitatively assess, for the first time, the capabilities of SiGe HBTs fabricated on thin-film SOI for emerging high-temperature circuit applications. The dc and ac performance of both fully-depleted and partially-depleted SiGe HBTs-on-SOI are measured up to a temperature of 330degC (for dc) and 200degC (for ac). Gummel characteristics, current gain, and output characteristics are reported. M-l is used to investigate how collector doping affects the device behavior at high temperatures. We demonstrate that despite the harsh conditions imposed by high-temperature operation, SiGe HBTs-on-SOI maintain adequate performance for many applications for temperatures in the 200-300degC range.
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