一种新型20 GHz微型化三维SiGe 90°混合耦合器,采用弯曲TFMS和带状线分流短段加载

K. Hettak, G. Morin, M. Stubbs
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引用次数: 1

摘要

本文提出了一种基于紧凑弯曲薄膜微带(TFMS)传输线和带状线分流短段加载的紧凑三维90度混合耦合器的新方案,并利用多层0.35 μ g SiGe HBT Jazz工艺成功地进行了演示。所提出的耦合器利用了SiGe技术中提供的多层次金属化工艺。与使用TFMS结构的传统混合耦合器相比,制备的3d混合耦合器的固有面积显着减小,并且在20 GHz时电路面积减小了92%。实验结果支持了这种新型微型耦合器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A New Miniaturized Type of Three-Dimensional SiGe 90° Hybrid Coupler at 20 GHz using The Meandering TFMS and Stripline Shunt Stub Loading
This paper proposes a new scheme for realizing a compact 3-D 90deg hybrid coupler based on the compact meandered thin-film microstrip (TFMS) transmission line and stripline shunt stub loading, and successfully demonstrated by using the multi-layer 0.35 mum SiGe HBT Jazz process. The proposed coupler takes advantage of the multi-level metallization processes offered in SiGe technology. The intrinsic area of the fabricated 3-D hybrid coupler is significantly reduced and has shown a size reduction of 92% in circuit area at 20 GHz compared to that of a conventional hybrid coupler using the TFMS configuration. Experimental results are presented in support of the novel miniature coupler.
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