金属-陶瓷绝缘体封装的钎焊

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298726

Wangchen Tu, Chuanzhen Chen, Kai Wangluning

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引用次数: 1

摘要

随着集成电路技术的发展，金属-陶瓷绝缘体封装在集成电路封装中得到了广泛的应用，并逐步发展出一系列产品，在封装领域发挥着重要的作用。尽管包装的类型不同，但基本结构是相同的。金属陶瓷绝缘子通常由底座、框架、引线、焊料和通过钎焊生产的陶瓷绝缘子组成。下面以JF04F3包为例进行详细介绍。

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The brazing of metal-ceramic insulator package

With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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