T. Winkel, M.F. Ktata, T. Ludwig, H. Grabinski, E. Klink
{"title":"在90纳米SOI/Cu技术中提取高达20 GHz的频率相关特征传输线参数","authors":"T. Winkel, M.F. Ktata, T. Ludwig, H. Grabinski, E. Klink","doi":"10.1109/EPEP.2004.1407565","DOIUrl":null,"url":null,"abstract":"S-parameter measurements were performed on special test lines embedded in an 8 copper metal layer test chip in order to determine the propagation constant y(f) and the complex characteristic impedance Z/sub 0/(f). Measurement results are presented for signal lines in the 7/sup th/ metal layer showing very good agreement with FEM-simulations in the frequency range up to 20 GHz.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"29 5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Extraction of frequency dependent characteristic transmission line parameters up to 20 GHz for global wiring in 90 nm SOI/Cu technology\",\"authors\":\"T. Winkel, M.F. Ktata, T. Ludwig, H. Grabinski, E. Klink\",\"doi\":\"10.1109/EPEP.2004.1407565\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"S-parameter measurements were performed on special test lines embedded in an 8 copper metal layer test chip in order to determine the propagation constant y(f) and the complex characteristic impedance Z/sub 0/(f). Measurement results are presented for signal lines in the 7/sup th/ metal layer showing very good agreement with FEM-simulations in the frequency range up to 20 GHz.\",\"PeriodicalId\":143349,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging - 2004\",\"volume\":\"29 5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging - 2004\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2004.1407565\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407565","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Extraction of frequency dependent characteristic transmission line parameters up to 20 GHz for global wiring in 90 nm SOI/Cu technology
S-parameter measurements were performed on special test lines embedded in an 8 copper metal layer test chip in order to determine the propagation constant y(f) and the complex characteristic impedance Z/sub 0/(f). Measurement results are presented for signal lines in the 7/sup th/ metal layer showing very good agreement with FEM-simulations in the frequency range up to 20 GHz.