新的硅前沿:物理柔性单片系统

2017 IEEE Workshop on Microelectronics and Electron Devices (WMED) Pub Date : 2017-04-21 DOI:10.1109/WMED.2017.7916930

Richard L. Chaney, Dale G. Wilson, D. Hackler, K. DeGregorio, Darrell E. Leber

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引用次数: 1

摘要

柔性混合电子结合了印刷电子和硅集成电路的最佳特性，以创建高性能，超薄，物理灵活的系统。介绍了将商业现成产品转换为物理灵活的FleX-IC格式的进展。本文研究了FleX-SoC，物理上灵活的片上系统，并报告了弯曲后NVM的评估，曲率半径降至5mm。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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New Silicon Frontiers: Physically Flexible System-On-A-Chip

Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. Advances in converting commercial off-the-shelf products into the physically flexible FleX-IC format are presented. This paper examines the FleX-SoC, physically flexible System-on-Chip, and reports evaluation of the NVM after bending with a radius of curvature down to 5mm.

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2017 IEEE Workshop on Microelectronics and Electron Devices (WMED)

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