大批量生产中晶圆图空间特征的自动检测

Proceedings 1999 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (EFT'99) Pub Date : 1999-11-01 DOI:10.1109/DFTVS.1999.802870

F. Duvivier

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引用次数: 15

摘要

在大批量生产中，对产量损失机制的快速响应时间是很重要的。本文提出了一种检测晶圆片空间产率损失的方法。程序自动计算并提供考虑到所有处理晶圆的签名摘要。这减少了对数据的手动操作，提供了更快的响应时间。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Automatic detection of spatial signature on wafermaps in a high volume production

In high volume production, it is important to have a fast response time to yield loss mechanisms. This paper presents a way to detect spatial yield loss on wafers. A procedure automatically computes and provides a summary of signatures taking into account all of the processed wafer. This reduces manual manipulation of data, providing a faster response time.

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来源期刊

Proceedings 1999 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (EFT'99)

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