T. Takeshima, M. Takada, H. Koike, H. Watanabe, S. Koshimaru, K. Mitake, W. Kikuchi, T. Tanigawa, T. Murotani, K. Noda, K. Tasaka, K. Yamanaka, K. Koyama
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引用次数: 6
摘要
作者描述了一种16mb的CMOS DRAM(动态RAM),具有55-ns的访问时间和130-mm/sup 2/芯片面积。它具有高速锁存感测(LS)方案和内置自检(BIST)功能,带有微可编程ROM,其中自动测试模式生成过程由微编码程序存储。为了实现55ns的访问时间,DRAM将LS方案与传统的双al层布线和5v外围电路相结合。图中显示了位线感测电路,由内部电压转换器以3.3 V驱动,以确保0.6 μ m MOS存储单元的可靠性。3.3 V工作时的传感速度和信号电压都比5 V工作时低。然而,LS方案弥补了这些缺点,实现了快速的访问时间和高灵敏度。给出了典型芯片在正常条件下55-ns行地址频闪访问时间的工作波形,并总结了芯片的特性
The authors describe a 16-Mb CMOS DRAM (dynamic RAM) with 55-ns access time and 130-mm/sup 2/ chip area. It features a high-speed latched sensing (LS) scheme and a built-in self-test (BIST) function with a microprogrammable ROM in which automatic test pattern generation procedures are stored by microcoded programs. To achieve 55-ns access time, the DRAM combines the LS scheme with conventional double-Al-layer wiring and 5-V peripheral circuits. The bit-line sense circuits, driven at 3.3 V from an internal voltage converter to ensure 0.6 mu m MOS memory cell reliability, are shown. Both sensing speed and signal voltage are lower at 3.3 V operation than at 5 V operation. However, the LS scheme compensates for these drawbacks and achieves fast access time and high sensitivity. Operational waveforms for 55-ns row-address-strobe access time for a typical chip under normal conditions are shown, and chip characteristics are summarized.<>