{"title":"一种在单片- wsi系统中提高时钟频率和通信速度的体系结构方法","authors":"D. Audet, Y. Savaria, N. Arel","doi":"10.1109/ICWSI.1994.291248","DOIUrl":null,"url":null,"abstract":"Based on special pipelining techniques, a new methodology for increasing the clock frequency and communication speed in monolithic-WSI systems is proposed. Spice simulations show that the clock frequency on wafer scale systems implemented using a 1.2 micron CMOS technology can be operated well above 140 MHz, which is approximatively five times the maximum frequency of current systems. It is also shown that pipelining principles can be applied to communication links. That particular strategy allows to speedup communication transfers on 5 cm interconnection wires, such as those running across a wafer, by a factor between two and ten, as compared to the case in which no pipelining is used.<<ETX>>","PeriodicalId":183733,"journal":{"name":"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-01-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"An architectural approach for increasing clock frequency and communication speed in monolithic-WSI systems\",\"authors\":\"D. Audet, Y. Savaria, N. Arel\",\"doi\":\"10.1109/ICWSI.1994.291248\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Based on special pipelining techniques, a new methodology for increasing the clock frequency and communication speed in monolithic-WSI systems is proposed. Spice simulations show that the clock frequency on wafer scale systems implemented using a 1.2 micron CMOS technology can be operated well above 140 MHz, which is approximatively five times the maximum frequency of current systems. It is also shown that pipelining principles can be applied to communication links. That particular strategy allows to speedup communication transfers on 5 cm interconnection wires, such as those running across a wafer, by a factor between two and ten, as compared to the case in which no pipelining is used.<<ETX>>\",\"PeriodicalId\":183733,\"journal\":{\"name\":\"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-01-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICWSI.1994.291248\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1994.291248","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An architectural approach for increasing clock frequency and communication speed in monolithic-WSI systems
Based on special pipelining techniques, a new methodology for increasing the clock frequency and communication speed in monolithic-WSI systems is proposed. Spice simulations show that the clock frequency on wafer scale systems implemented using a 1.2 micron CMOS technology can be operated well above 140 MHz, which is approximatively five times the maximum frequency of current systems. It is also shown that pipelining principles can be applied to communication links. That particular strategy allows to speedup communication transfers on 5 cm interconnection wires, such as those running across a wafer, by a factor between two and ten, as compared to the case in which no pipelining is used.<>