三栅MOSFET器件寄生特性的分析建模

R. Bose, J. N. Roy
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引用次数: 0

摘要

在本文中,提出了一个简单的分析模型的实验三栅极FinFET器件,提供了一个详细的了解器件的内置寄生电阻和电容。纳米尺度下的非平面器件结构由于具有多个栅极、窄翅片宽度和窄源漏区宽度,通常具有较高的寄生电阻和寄生电容。建立了基于表面电位的电荷模型来确定寄生电容。该模型与三维TCAD Sentaurus装置仿真结果吻合较好。该模型估计了寄生源/漏极电阻的缩放限制,并揭示了接触电阻在三极管FinFET器件的寄生电阻中占主导地位。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analytical Modeling for Parasitics in a Triple Gate MOSFET Device
In this paper, simple and analytical models are proposed for a experimental trigate FinFET device which provides a detailed understanding of the inbuilt parasitic resistance and capacitance of the device. The non planar device structures in nano scale regime usually experiences high parasitic resistances and capacitances due to having multiple gates, narrow fin width and narrow source/drain region width as well. A surface potential based charge model is also developed to determine parasitic capacitances. Our proposed model shows good agreement with 3D TCAD Sentaurus device simulation result. The model estimates a limit to scaling of parasitic source/drain resistance and also reveals that contact resistance dominates parasitic resistance of trigate FinFET device.
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