利用压阻式应力传感器分析四次弯曲实验中QFN封装的应力状态

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI:10.1109/EuroSimE52062.2021.9410886

Daniel Riegel, P. Gromala, S. Rzepka

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引用次数: 2

摘要

本文对四点弯曲试验及其与数值模拟的关系进行了全面的研究。作为测试车辆，我们使用了一块电路板，在PCB的顶部和底部焊接了16个QFN组件。每个QFN有两个压阻式应力传感器。每个传感器有60个应力传感单元，每个QFN总共有120个。本文利用压阻式应力传感器对QFN的应力状态进行了研究，并与数值模型进行了比较。应力分析表明，与放置在PCB中心的其他组件相比，非常靠近边缘的组件暴露于略高的应力(20%)。在数值模拟中，我们发现精确的几何形状是影响精度的最重要因素。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Analysis of the stress state in QFN package during four bending experiment utilizing piezoresistive stress sensor

This paper reports a comprehensive study on four point bending experiment and its correlation with numerical simulation. As test vehicle we have used a board with 16 QFN components soldered on the top and bottom side of the PCB. Each QFN had two piezoresistive stress sensors. Each sensor has 60 stress sensing cells, in total 120 per QFN. In our study we have investigated the stress state in the QFN utilizing piezoresisitve stress sensor and compare it with numerical model. Stress analysis showed that components very close to the edge are exposed to the slightly higher stress (20%) as the other components placed in the center of the PCB. In case of numerical simulation, we have found that the most important on accuracy is the exact geometry.

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2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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