Ziliang Miao, Buwei He, Hubocheng Tang, Jixiang Chen, Zhenkun Wang
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引用次数: 0
摘要
本文提出了一种新的昂贵全局优化方法,即用于昂贵全局优化的元模型堆叠集成(Stacked Ensemble of metmodels for expensive global optimization, SEMGO†),旨在提高代理的准确性和鲁棒性。由于现有的元模型集成方法采用固定的线性加权策略,在面对各种问题时容易产生偏差。SEMGO采用基于学习的第二层模型,自适应地结合第一层元模型的预测。在17个广泛使用的基准问题上,将所提出的SEMGO与三种最先进的元模型集成方法进行了比较。在17个基准问题上的实验结果表明,SEMGO优于3种最先进的元模型集成方法。结果表明,SEMGO的性能最好。此外,将该方法应用于解决实际的芯片封装问题,大大改善了先前的优化结果。
Stacked Ensemble of Metamodels for Expensive Global Optimization
This paper proposes a novel expensive global optimization method, namely Stacked Ensemble of Metamodels for Expensive Global Optimization (SEMGO ††), which aims to improve the accuracy and robustness of the surrogate. Since the existing metamodel ensemble methods leverage fixed linear weighting strategies, they are likely to result in bias when facing various problems. SEMGO employs a learning-based second-layer model to combine the predictions of the first-layer metamodels adaptively. The proposed SEMGO is compared with three state-of-the-art metamodel ensemble methods on seventeen widely used benchmark problems. The experimental results on seventeen benchmark problems show that SEMGO outperforms three state-of-the-art metamodel ensemble methods. The results show that SEMGO performs the best. In addition, the proposed method is applied to solve a practical chip packaging problem, and the previous optimization result is improved over a large margin.