用于光刻胶薄膜厚度表征的96 ghz互补劈开环谐振器

N. Chudpooti, Sukanya Chudpooti, P. Akkaraekthalin, I. Robertson, N. Somjit
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引用次数: 0

摘要

非破坏性厚度测量为薄聚合物在工业和医疗上的应用提供了一个有价值的特征。在此,我们开发了一种新型的、非破坏性的毫米波WR-10波导传感器,用于测量透明衬底上的介电膜层。互补裂环谐振器(CSRR)集成在定制的WR10波导上,工作频率为96 GHz。然后使用谐振频移检查涂覆在玻璃基板上的SU-8层的厚度,范围从3 - 13j .1m。该传感器测得的厚度值与标准表面轮廓仪测得的厚度值非常接近,差异小于5%。因此,与现有的商业仪器相比,我们的新设计提供了相当的精度和更好的成本效益。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
96-GHz Complementary Split Ring Resonator for Thin Photoresist Film Thickness Characterization
Non-destructive thickness measurement offers a valuable feature for thin polymer-based applications in both industrial and medical utilization. Herein, we developed a novel, non-destructive, millimetre-wave WR-10 waveguide sensor for measuring a dielectric film layer on a transparent substrate. Complementary split-ring resonator (CSRR) was integrated on top of a customized WR10 waveguide and operated at 96 GHz. The thickness of the SU-8 layers, ranging from 3–13 J.1m, coated on a glass substrate was then examined using the resonant frequency shift. The thickness values obtained from this novel sensor strongly resemble the values obtained from standard surface profiler measurement method, with less than 5 % difference. Thus, our novel design offers a comparable accuracy with a better cost effectiveness when compare with an existing commercial instrument.
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