Electrical modeling and analysis of carbon based three dimensional integration

Based on extracted equivalent circuit parameters, this paper established the power delivery network model of carbon-based three-dimensional (3-D) integration and derived analytical formulas to predict the voltage drop in the proposed 3-D circuit, in which the horizontal interconnects and vertical TSVs are built with multi-layer graphene nanoribbons (MLGNRs) and carbon nanotubes (CNTs), respectively. Comparison in electrical performance shows that the voltage drop of 3-D integration is dominated by vertical components and therefore increasing the total number of signal/ground TSVs used for power delivery can significantly decrease the maximum voltage drop in 3-D integration. For present fabrication limits, only carbon based 3D integration built with larger diameter MWCNT TSVs and MLGNRs can obtain lower voltage drops in comparison to Cu interconnects. The proposed results would provide some design guides for future carbon-based 3-D integration.