16nm、14nm和7nm节点上基于finfet的SRAM puf可靠性分析

S. Masoumian, G. Selimis, Rui Wang, G. Schrijen, S. Hamdioui, M. Taouil
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引用次数: 2

摘要

SRAM物理不可克隆函数(puf)是当今商业上用于安全原语(如密钥生成和身份验证)的其他功能之一。puf的质量以及安全原语的质量取决于依赖于技术的内在变化。因此,为了维持puf在尖端技术中的商业应用,正确建模和评估其可靠性非常重要。在这项工作中,我们通过低功耗和高性能设计的模拟和硅验证,评估了SRAM PUF在16nm, 14nm和7nm的汉明距离(WCHD)内的可靠性。结果表明,我们的仿真模型和预期与硅的测量结果相吻合。从实验中,我们得出以下结论:(1)SRAM PUF在先进的FinFET技术节点上是可靠的,即在16nm, 14nm和7nm处噪声较低;(2)温度变化对可靠性的影响很小;(3)低功耗和高性能SRAM都可以作为PUF使用,而不需要过多的纠错码(ecc)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliability Analysis of FinFET-Based SRAM PUFs for 16nm, 14nm, and 7nm Technology Nodes
SRAM Physical Unclonable Functions (PUFs) are among other things today commercially used for secure primitives such as key generation and authentication. The quality of the PUFs and hence the security primitives, depends on intrinsic variations which are technology dependent. Therefore, to sustain the commercial usage of PUFs for cutting-edge technologies, it is important to properly model and evaluate their reliability. In this work, we evaluate the SRAM PUF reliability using within class Hamming distance (WCHD) for 16nm, 14nm, and 7nm using simulations and silicon validation for both low-power and high-performance designs. The results show that our simulation models and expectations match with the silicon measurements. From the experiments, we conclude the following: (1) SRAM PUF is reliable in advanced FinFET technology nodes, i.e., the noise is low in 16nm, 14nm, and 7nm, (2) temperature variations have a marginal impact on the reliability, and (3) both low-power and high-performance SRAMs can be used as a PUF without excessive need of error correcting codes (ECCs).
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