印刷电路板中经孔诱导平行板共振的表征

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967612

M. Iwanami, S. Hoshino

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引用次数: 0

摘要

本文描述了多层印刷电路板(PCB)中由通孔穿透平行板引起的平行板共振的基本特性。从实验和模拟结果出发，讨论了|S/sub 21/|特性强共振峰的来源。结果表明，除通孔外，并联板输入阻抗中平行谐振频率与信号走线输入阻抗中平行谐振频率的对应关系可能产生强谐振峰。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Characterization of via-induced parallel-plate resonances in a printed circuit board

This paper describes the fundamental characteristics of parallel-plate resonances which are induced by the via penetrating a parallel-plate in a multilayer printed circuit board (PCB). From the results of experiments and simulations, the origin of the strong resonance peak in the |S/sub 21/| characteristic is discussed. It is shown that the strong resonance peak may result from the correspondence between the parallel resonance frequencies in the input impedance of the parallel-plate and in that of the signal trace with the exception of the via.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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