300mm晶圆时代的全新晶圆厂概念

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI:10.1109/ISSM.2000.993613

A. Koike

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引用次数: 5

摘要

Trecenti Technologies, Inc.目前正在创建第一个300mm晶圆量产晶圆厂。我们的基本目标是最大限度地缩短所有单晶圆工艺的周期时间，并创建一个可扩展的晶圆厂，该晶圆厂具有优化的扩展单元，以满足高投资效率和灵活性，以适应不断变化的市场需求。

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A new fab concept in the 300 mm wafer era

Trecenti Technologies, Inc. is currently creating the first 300 mm-wafer volume production fab. Our basic objectives are to minimize cycle time with all single-wafer processes and to create a scalable fab that has an optimized expansion unit to satisfy high investment efficiency and flexibility to changing market needs.

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Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)

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