多层陶瓷电容器裂纹的断裂力学分析

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Pub Date : 2014-11-24 DOI:10.1109/ESTC.2014.6962828

J. Al Ahmar, S. Wiese

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引用次数: 9

摘要

建立了多层陶瓷电容器的有限元模型。估计了热机械载荷引起的应力分布。考虑焊接过程后的热冷却，然后进行三点弯曲试验。一旦确定了陶瓷的临界应力区域，就可以进行断裂力学分析。采用基于裂纹张开位移的直接法和通过计算j积分参数的能量法来估计裂纹的起始和断裂参数。最后利用断裂力学参数对裂纹分岔进行了研究。

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Fracture mechanics analysis of cracks in multilayer ceramic capacitors

Finite element modelling of multilayer ceramic capacitors (MLCCs) is presented. The stress distribution due to thermo-mechanical loads is estimated. Thermal cool down after soldering process is considered and afterwards a three point bending test has been done. Once the critical stress regions on ceramic are estimated, a fracture mechanics analysis has been performed. Cracks are initiated and fracture parameters were estimated using a direct approach, based on the crack opening displacement and also an energy approach by calculating the J-integral parameter. Finally the fracture mechanics parameters are used for investigating the crack bifurcation.

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Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)

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