基于微力学试验和有限元模型的BEoL堆叠失效模式评估

J. Silomon, A. Clausner, E. Zschech
{"title":"基于微力学试验和有限元模型的BEoL堆叠失效模式评估","authors":"J. Silomon, A. Clausner, E. Zschech","doi":"10.1109/IPFA55383.2022.9915739","DOIUrl":null,"url":null,"abstract":"In this work, the results of a mechanical BEoL (back end of line) stack failure mode evaluation study of a high-end microchip are presented. Deploying micromechanical testing approaches enables the determination of different failure modes and, in some cases and with the right methods, the identification of the location of damage initiation as well as an estimation of damage propagation. However, it is not possible to determine the mechanical stress conditions inside the BEoL stack which cause these damages experimentally. To obtain this information, it is required to develop and deploy an FEM (Finite Element Method) simulation model. In this work, the experimental results of the application of two micromechanical loading methods to induce three different failure modes into a BEoL stack are presented. These results have partially been introduced in the previous studies [1], [2], and [3] but are put into perspective and aligned with FEM simulation results to obtain a more holistic understanding of the occurring damage modes and the related mechanical conditions. The FEM simulations have been utilized to quantify the critical values and location of mechanical stresses inside of the BEoL stack which result in the mechanical failure modes. A Cu-pillar shear approach has been deployed as well as a soldering and tensile loading approach. These methods have been introduced in a detailed manner in [4]. Sub-critical modifications of these Cu-pillar loading experiments as described in [2] and [4] in which AE (acoustic emission) was utilized as a damage indicator, have been deployed as well to determine the damage initiation location and progression through the BEoL stack. Based on this combined method consisting of the experimental approaches and the related FEM simulations, mechanical failure models of the investigated BEoL stack could be derived. These include the location of damage initiation and the related mechanical stresses as well as an estimated damage progression. A specific design optimization is suggested based on the results presented in this study and evaluated deploying an additional FEM simulation with the mechanical loading conditions of the tensile failure mode.","PeriodicalId":378702,"journal":{"name":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"51 5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"BEoL Stack Failure Mode Evaluation Utilizing Micromechanical Testing and FEM Modelling\",\"authors\":\"J. Silomon, A. Clausner, E. Zschech\",\"doi\":\"10.1109/IPFA55383.2022.9915739\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, the results of a mechanical BEoL (back end of line) stack failure mode evaluation study of a high-end microchip are presented. Deploying micromechanical testing approaches enables the determination of different failure modes and, in some cases and with the right methods, the identification of the location of damage initiation as well as an estimation of damage propagation. However, it is not possible to determine the mechanical stress conditions inside the BEoL stack which cause these damages experimentally. To obtain this information, it is required to develop and deploy an FEM (Finite Element Method) simulation model. In this work, the experimental results of the application of two micromechanical loading methods to induce three different failure modes into a BEoL stack are presented. These results have partially been introduced in the previous studies [1], [2], and [3] but are put into perspective and aligned with FEM simulation results to obtain a more holistic understanding of the occurring damage modes and the related mechanical conditions. The FEM simulations have been utilized to quantify the critical values and location of mechanical stresses inside of the BEoL stack which result in the mechanical failure modes. A Cu-pillar shear approach has been deployed as well as a soldering and tensile loading approach. These methods have been introduced in a detailed manner in [4]. Sub-critical modifications of these Cu-pillar loading experiments as described in [2] and [4] in which AE (acoustic emission) was utilized as a damage indicator, have been deployed as well to determine the damage initiation location and progression through the BEoL stack. Based on this combined method consisting of the experimental approaches and the related FEM simulations, mechanical failure models of the investigated BEoL stack could be derived. These include the location of damage initiation and the related mechanical stresses as well as an estimated damage progression. A specific design optimization is suggested based on the results presented in this study and evaluated deploying an additional FEM simulation with the mechanical loading conditions of the tensile failure mode.\",\"PeriodicalId\":378702,\"journal\":{\"name\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"51 5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA55383.2022.9915739\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA55383.2022.9915739","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在这项工作中,介绍了高端微芯片的机械BEoL(后端线路)堆栈失效模式评估研究的结果。采用微力学测试方法可以确定不同的失效模式,在某些情况下,通过正确的方法,可以确定损伤开始的位置以及损伤扩展的估计。然而,无法通过实验确定导致这些损伤的BEoL叠层内部的机械应力条件。为了获得这些信息,需要开发和部署FEM (Finite Element Method)仿真模型。本文介绍了应用两种微力学加载方法诱导三种不同失效模式的BEoL堆叠的实验结果。这些结果在之前的研究[1]、[2]和[3]中已经有了部分介绍,但我们将这些结果与FEM模拟结果结合起来,以获得对发生损伤模式和相关力学条件的更全面的理解。利用有限元模拟方法定量分析了BEoL叠层内部导致机械失效模式的机械应力临界值和位置。采用了铜柱剪切方法以及焊接和拉伸加载方法。这些方法在b[4]中都有详细的介绍。在[2]和[4]中描述了这些铜柱加载实验的亚临界修改,其中AE(声发射)被用作损伤指标,也被用于确定BEoL堆栈的损伤起始位置和进展。基于实验方法和有限元模拟相结合的方法,可以推导出所研究的BEoL叠层的力学失效模型。这些包括损伤起始位置和相关的机械应力以及估计的损伤进展。基于本研究的结果提出了具体的设计优化建议,并在拉伸破坏模式的机械加载条件下进行了额外的有限元模拟。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
BEoL Stack Failure Mode Evaluation Utilizing Micromechanical Testing and FEM Modelling
In this work, the results of a mechanical BEoL (back end of line) stack failure mode evaluation study of a high-end microchip are presented. Deploying micromechanical testing approaches enables the determination of different failure modes and, in some cases and with the right methods, the identification of the location of damage initiation as well as an estimation of damage propagation. However, it is not possible to determine the mechanical stress conditions inside the BEoL stack which cause these damages experimentally. To obtain this information, it is required to develop and deploy an FEM (Finite Element Method) simulation model. In this work, the experimental results of the application of two micromechanical loading methods to induce three different failure modes into a BEoL stack are presented. These results have partially been introduced in the previous studies [1], [2], and [3] but are put into perspective and aligned with FEM simulation results to obtain a more holistic understanding of the occurring damage modes and the related mechanical conditions. The FEM simulations have been utilized to quantify the critical values and location of mechanical stresses inside of the BEoL stack which result in the mechanical failure modes. A Cu-pillar shear approach has been deployed as well as a soldering and tensile loading approach. These methods have been introduced in a detailed manner in [4]. Sub-critical modifications of these Cu-pillar loading experiments as described in [2] and [4] in which AE (acoustic emission) was utilized as a damage indicator, have been deployed as well to determine the damage initiation location and progression through the BEoL stack. Based on this combined method consisting of the experimental approaches and the related FEM simulations, mechanical failure models of the investigated BEoL stack could be derived. These include the location of damage initiation and the related mechanical stresses as well as an estimated damage progression. A specific design optimization is suggested based on the results presented in this study and evaluated deploying an additional FEM simulation with the mechanical loading conditions of the tensile failure mode.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信