基于45nm SOI-CMOS工艺的低损耗宽带dc - 67ghz SP3T交换网络

Stephen Pancrazio, P. Nguyen, A. Pham, Matthew S. Clements, Abdi Karbassi, Scott Sacks
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引用次数: 0

摘要

在本文中,我们提出了一种宽带DC-67 GHz单极三掷(SP3T)开关,该开关采用串联分流拓扑,采用来自全球代工厂的45纳米绝缘体上硅(SOI) CMOS工艺。对于宽带工作,采用串联电感谐振出开关中使用的NMOS晶体管漏极和源端寄生电容。此外,对于分流分支,采用双堆栈-场效应管拓扑来处理更高的功率电平。总的来说,在10 MHz到67 GHz的频率范围内,开关的插入损耗从1.42 dB到2.62 dB。测量到的20 GHz输入1 db压缩功率(IP1dB)超过10 dBm,而20 GHz三阶输入截距点(IIP3)为20.8 dBm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Low Loss Wideband DC-67 GHz SP3T Switching Network on 45nm SOI-CMOS Process
In this paper, we present a wideband DC-67 GHz single-pole-triple-throw (SP3T) switch using a series-shunt topology on 45-nm silicon-on-insulator (SOI) CMOS process from global foundries. For wideband operation, series inductors are implemented to resonate out the parasitic capacitance at drain and source terminals of NMOS transistors used in the switch. Additionally, for shunt branches, a double stack-FET topology is used to handle higher power levels. In all, the switch has an insertion loss from 1.42 dB to 2.62 dB over frequency range from 10 MHz to 67 GHz. The measured input 1-dB compression power (IP1dB) at 20 GHz exceeds 10 dBm while the third order input intercept point (IIP3) at 20 GHz is 20.8 dBm.
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