热设计软件系统的可靠性分析

2008 International Conference on Perspective Technologies and Methods in MEMS Design Pub Date : 2008-05-21 DOI:10.1109/MEMSTECH.2008.4558757

D. Fedasyuk, M. Seniv, P. Serdyuk

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引用次数: 2

摘要

在软件可靠性测试中，采用了基于随机泊松过程的软件可靠性估计模型，确定并预测了软件在设定时刻的故障概率及其可靠性。开发了计算机辅助测试的软件环境，用于验证求解导热系数问题的计算软件。关键词:软件可靠性;

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The reliability analysis of thermal design software system

For the software reliability testing the model of software reliability estimation, which is based on the random Poisson process, has been used, which determines and allows to forecast the software fault probability and its reliability in the set moment of time. The software environment of computer-aided testing for the verification of computational software for the solution of thermal conductivity problems has been developed. Keywords - software reliability,

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2008 International Conference on Perspective Technologies and Methods in MEMS Design

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