外源电容对GSMBE生长的Ga/sub 0.51/In/sub 0.49/P/GaAs misfet (0 nm/spl les/t/spl les/10 nm)微波性能的影响

Yo‐Sheng Lin, Shey-Shi Lu
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引用次数: 0

摘要

通过改变Ga/sub 0.51/In/sub 0.49/P/GaAs misfet绝缘层的厚度,首先从实验和理论上研究了外部电容对其微波性能的影响。由于外部电容较小,采用气桥栅极结构的misfet比传统栅极结构的misfet具有更高的f/sub t/s和f/sub max/s。对于1 /spl mu/m栅极长度器件,f/sub t/s和f/sub max/s的最大值均发生在t在50 nm ~ 100 nm之间。结果表明,绝缘体厚度在50 ~ 100 nm之间的Ga/sub 0.51/In/sub 0.49/P/GaAs气桥栅misfet非常适合用于微波高功率器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effect of extrinsic capacitances on the microwave performance of Ga/sub 0.51/In/sub 0.49/P/GaAs MISFETs (0 nm/spl les/t/spl les/10 nm) grown by GSMBE
The effect of extrinsic capacitances on the microwave performance of Ga/sub 0.51/In/sub 0.49/P/GaAs MISFETs was first studied experimentally and theoretically by varying the thickness of the Ga/sub 0.51/In/sub 0.49/P insulating layer. MISFETs with airbridge gate structure showed higher f/sub t/s, and f/sub max/s than those of MISFETs with traditional gate structure due to the lower extrinsic capacitances. Moreover, the maximum values of f/sub t/s, and f/sub max/s for a 1 /spl mu/m gate length device all happen when t is between 50 nm and 100 nm. These results demonstrate that Ga/sub 0.51/In/sub 0.49/P/GaAs airbridge gate MISFETs with insulator thickness between 50 nm and 100 nm were very suitable for microwave high power device applications.
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