倒装晶片封装中介面分层分析

L. Mercado, V. Sarihan, T. Hauck
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引用次数: 18

摘要

界面分层是倒装PBGA(塑料球栅阵列)封装的重要失效模式。它对封装的性能和可靠性起着重要的作用。本文采用断裂力学的方法来评估界面分层对封装可靠性的影响。界面裂缝为ⅰ型(张开型)和ⅱ型(剪切型)混合裂缝。为了表征电子封装中的界面,必须将界面韧性定义为不同模态混合或加载相角的函数。本文将界面断裂力学引入有限元分析,确定界面断裂的临界参数。所提出的方法通过解析解进行了验证。研究了一种具有下填充层脱层的倒装PBGA封装。评估了温度、初始分层长度、包层几何形状和材料对断裂参数的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An analysis of interface delamination in flip-chip packages
Interface delamination is an important failure mode for flip-chip PBGA (plastic ball grid array) packages. It plays a significant role on package performance and reliability. In this paper, a fracture mechanics approach is utilized to evaluate the impact of interface delamination on package reliability. Interface cracks are mixed mode cracks with both mode I (opening mode) and mode II (shear mode) components. To characterize the interfaces in electronic packages, it is essential to define the interfacial toughness as a function of different mode mixity, or loading phase angle. In this paper, interface fracture mechanics is incorporated into finite element analysis to determine the critical interface fracture parameters. The proposed methodology is validated against analytical solutions. A Flip-Chip PBGA package with underfill delamination is studied. The effect of temperature, initial delamination length, package geometry and materials on the fracture parameters is evaluated.
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