MULTI-PRIDE:支持多层印刷线路板设计的系统

Proceedings of ASP-DAC '97: Asia and South Pacific Design Automation Conference Pub Date : 1997-01-28 DOI:10.1109/ASPDAC.1997.600124

Toshimasa Watanabe

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引用次数: 0

摘要

本文的目的是概述MULTI-PRIDE，一个支持多层印刷线路板设计的系统。它包括(i)电路双分区，(ii)每个外层的放置和布线，(iii)修改布线和压实，以及(iv)内层的布线。

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MULTI-PRIDE: a system for supporting multi-layered printed wiring board design

The purpose of the paper is to outline MULTI-PRIDE, a system for supporting multi-layered printed wiring board design. It consists of (i) circuit bipartition, (ii) placement and routing on each outside layer, (iii) modification of wiring and compaction, and (iv) routing on inside layers.

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Proceedings of ASP-DAC '97: Asia and South Pacific Design Automation Conference

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