硅:用于可弯曲电子设备和传感器的柔性材料

Y. Kervran, K. Kandoussi, Hanpeng Dong, S. Janfaoui, N. Coulon, C. Simon, E. Jacques, T. Mohammed‐Brahim
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引用次数: 0

摘要

当需要包括处理电子和传感功能的可弯曲系统时,在低温下直接结晶沉积的硅被证明是正确的材料。特别是当工艺可重复性、设备的电气和机械可靠性是意味着技术成功的最重要参数时,情况更是如此。事实上,当我们需要超越论文的发表,走向实际的商业应用时,这些参数是主要问题。研究了25 μm厚柔性塑料上微晶硅薄膜晶体管和变形传感器在高弯曲条件下(曲率半径仍为0.75 mm)的电学和力学性能。这些器件在最高温度为180°C的情况下直接在该衬底上制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon: A flexible material for bendable electronics and sensors
Directly crystallized deposited silicon at low temperature is shown to be the right material when bendable system including treatment electronics and sensing functions is needed. This is true particularly when process reproducibility, electrical and mechanical reliability of the devices are the most important parameters implying the success of the technology. Indeed, these parameters are the main issues when we need to go beyond the publication of a paper, towards actual commercial application. Electrical and mechanical performances of microcrystalline silicon thin film transistors and deformation sensors on 25 μm thick flexible plastics under high bending, still 0.75 mm curvature radius, are presented. These devices are fabricated directly on this substrate at a maximum temperature of 180°C.
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