sram电池性能退化的一致性预测模拟,包括MOSFET制造变化和老化

Hiroaki Gau, Nezam Rohbani, T. Maiti, D. Navarro, M. Miura-Mattausch, H. Mattausch, H. Takatsuka
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引用次数: 0

摘要

我们已经开发了一种方法来模拟电路老化,包括器件制造变化,较少的模拟工作。以6T SRAM单元为例进行了研究。结果表明,由于器件的长期老化,电路性能的变化范围进一步增大。在器件参数中,杂质浓度的变化对电路性能的变化起着特别重要的作用。而对老化退化最敏感的是通道长度的变化,因为通道长度的变化会大大增加老化效应。此外,每个MOSFET的单独老化在电路工作期间强烈依赖于实际应力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Consistent Predictive Simulation of SRAM-Cell Performance Degradation Including Both MOSFET Fabrication Variation and Aging
We have developed a methodology to simulate circuit aging including the device fabrication variation with less simulation effort. As an example a 6T SRAM cell has been investigated. It is demonstrated that the variability range of the circuit performance is further enhanced due to the long-term device aging. Among the device parameters, the impurity concentration variation plays a particularly important role for the circuit performance variation. However, most sensitive for the aging degradation is the channel-length variation, because it increases the aging effect drastically. Further, the individual aging of each MOSFET is strongly dependent on the actual stress during circuit operation.
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