C. Lee, M.F. Davis, S. Yoon, S. Chakraborty, A. Sutono, K. Lim, S. Pinel, J. Laskar
{"title":"c波段全有机发射机模块","authors":"C. Lee, M.F. Davis, S. Yoon, S. Chakraborty, A. Sutono, K. Lim, S. Pinel, J. Laskar","doi":"10.1109/GAAS.2002.1049070","DOIUrl":null,"url":null,"abstract":"We present the first report of a fully integrated multilayer organic (MLO)-based transmitter module incorporating a single MMIC for WLAN applications. We report the design and measurement of a C-band upconverter MMIC with excellent LO and image rejection as well as wideband operation fabricated in a commercial GaAs MESFET process. This development of a complete module also includes a miniaturized integrated square patch resonator band pass filter (BPF) with inset feed lines fabricated in MLO packaging technology. This realizes a compact and. highly integrated transmitter module suitable for the low cost network interface card (NIC), IEEE 802.11a WLAN applications in 56 GHz frequency band. This transmitter module demonstrates the feasibility of developing a miniature high performance and highly integrated wireless system on package (SOP)-based solutions.","PeriodicalId":142875,"journal":{"name":"24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A C-band fully organic-based transmitter module\",\"authors\":\"C. Lee, M.F. Davis, S. Yoon, S. Chakraborty, A. Sutono, K. Lim, S. Pinel, J. Laskar\",\"doi\":\"10.1109/GAAS.2002.1049070\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present the first report of a fully integrated multilayer organic (MLO)-based transmitter module incorporating a single MMIC for WLAN applications. We report the design and measurement of a C-band upconverter MMIC with excellent LO and image rejection as well as wideband operation fabricated in a commercial GaAs MESFET process. This development of a complete module also includes a miniaturized integrated square patch resonator band pass filter (BPF) with inset feed lines fabricated in MLO packaging technology. This realizes a compact and. highly integrated transmitter module suitable for the low cost network interface card (NIC), IEEE 802.11a WLAN applications in 56 GHz frequency band. This transmitter module demonstrates the feasibility of developing a miniature high performance and highly integrated wireless system on package (SOP)-based solutions.\",\"PeriodicalId\":142875,\"journal\":{\"name\":\"24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-12-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GAAS.2002.1049070\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.2002.1049070","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We present the first report of a fully integrated multilayer organic (MLO)-based transmitter module incorporating a single MMIC for WLAN applications. We report the design and measurement of a C-band upconverter MMIC with excellent LO and image rejection as well as wideband operation fabricated in a commercial GaAs MESFET process. This development of a complete module also includes a miniaturized integrated square patch resonator band pass filter (BPF) with inset feed lines fabricated in MLO packaging technology. This realizes a compact and. highly integrated transmitter module suitable for the low cost network interface card (NIC), IEEE 802.11a WLAN applications in 56 GHz frequency band. This transmitter module demonstrates the feasibility of developing a miniature high performance and highly integrated wireless system on package (SOP)-based solutions.