{"title":"Mcms上线键合装置的返工","authors":"C. Proietti-Bowne, P. Elenius","doi":"10.1109/ICMCM.1994.753530","DOIUrl":null,"url":null,"abstract":"The rework of wire bonded devices on MCMs (Multi Chip Modules) has historically been a manual procedure that has been time consuming and prone to operator error. This paper describes a complete rework process from the removal of the wires and device to the die attach material. The wires are removed using the Harmonicair/sup TM/. The Harmonicair leaves a very repeatable wire remnant on the substrate bond pad to facilitate the bonding of the next wire. The device is removed with a tensile process and the die attach material is then removed through a controlled shaving process.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"217 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Rework of Wire Bonded Devices on Mcms\",\"authors\":\"C. Proietti-Bowne, P. Elenius\",\"doi\":\"10.1109/ICMCM.1994.753530\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The rework of wire bonded devices on MCMs (Multi Chip Modules) has historically been a manual procedure that has been time consuming and prone to operator error. This paper describes a complete rework process from the removal of the wires and device to the die attach material. The wires are removed using the Harmonicair/sup TM/. The Harmonicair leaves a very repeatable wire remnant on the substrate bond pad to facilitate the bonding of the next wire. The device is removed with a tensile process and the die attach material is then removed through a controlled shaving process.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"217 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753530\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753530","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The rework of wire bonded devices on MCMs (Multi Chip Modules) has historically been a manual procedure that has been time consuming and prone to operator error. This paper describes a complete rework process from the removal of the wires and device to the die attach material. The wires are removed using the Harmonicair/sup TM/. The Harmonicair leaves a very repeatable wire remnant on the substrate bond pad to facilitate the bonding of the next wire. The device is removed with a tensile process and the die attach material is then removed through a controlled shaving process.
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