RFID标签的导电印刷及大批量增材生产的芯片接触方法

M. Kerndl, P. Steffan
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引用次数: 0

摘要

新兴的物联网(IoT)范式对制造工艺的不断创新施加了压力,主要是可以显著减少制造零件浪费和成本的增材制造技术。打印是大批量、低成本、快速上市的增材制造方法。本文简要比较了目前用于电子制造的印刷技术,主要用于低成本的射频识别(RFID),近场通信(NFC)标签,智能标签,智能包装,传感器等,重点是“胶版光刻”。这种方法提出了很大的挑战,其中之一就是芯片接触法。本文总结了目前适用于柔性基板上印刷电子产品的接触方法,重点介绍了有前途的非接触式RFID磁耦合方法,该方法不需要芯片和天线本身之间的导电连接。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production
The emerging Internet of Things (IoT) paradigm keeps pressure on constant innovation of manufacturing processes, mainly on additive technologies that can significantly reduce waste and cost of manufactured parts. Promising field for high volume, low cost and quick time to market additive fabrication method is printing. This paper briefly compares current printing technologies used for electronics fabrication, mainly for low cost Radio Frequency Identification (RFID), Near Field Communication (NFC) tags, smart labels, smart packaging, sensors etc. with focus on "offset lithography". This method raises a big challenges, one of them is chip contacting method. This work summarizes current contacting methods suitable for printed electronics on flexible substrates with focus on promising contactless RFID magnetic coupling method that does not require conductive connection between chip and antenna itself.
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