多孔硅在5-350k温度范围内作为硅片上有效的局部热隔离平台

K. Valalaki, A. Nassiopoulou
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引用次数: 1

摘要

在5-350K温度范围内测定了高孔硅的导热系数。在20-350K范围内,其温度依赖性是单调的,而在20K以下,其表现出与非晶材料相似的高原行为。在研究的整个温度范围内,材料的导热系数很低,也延伸到低温,使多孔硅成为一种优秀的局部衬底,可以在硅片上为加热和冷却设备的片上集成提供有效的热隔离。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Porous silicon as an efficient local thermal isolation platform on the Si wafer in the temparature range 5–350k
The thermal conductivity of highly porous Si was determined in the temperature range 5-350K. It was found that its temperature dependence is monotonic in the range 20-350K, while below 20K it shows a plateau-like behavior similar to that observed in amorphous materials. The low values of the thermal conductivity of the material in the whole temperature range studied, extended also to cryogenic temperatures, make porous Si an excellent local substrate for providing efficient thermal isolation on the Si wafer for the on-chip integration of heating and cooling devices.
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