单端与差分信号的性能潜力比较

Zhaoqing Chen, G. Katopis
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引用次数: 7

摘要

本文记录了10-40Gb/s单端和差分信号在高损耗一级封装结构上互连距离为12- 20mm的性能比较。比较基于电路模拟器的眼图,使用具有频率相关RLGC参数的多耦合传输线模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A comparison of performance potentials of single ended vs. differential signaling
The performance comparison of single ended and differential signaling of 10-40Gb/s is documented here with an interconnect distance of 12-20 mm on a high loss first level packaging structure. The comparison was based on eye diagrams by circuit simulators using multi-coupled transmission line models with frequency-dependent RLGC parameters.
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