An FEM study of die attach packaging effect on nanomechanical Si optical filters

This paper presents a finite element analysis of die attach packaging stress effect on emerging nanomechanical silicon optical filters. The proposed silicon optical filter is composed of Si waveguides and a microring resonator having a few hundred nm in thickness and a few tens of μm in length. Photonic integrated circuit is typically implemented by attaching a new component to a common ceramic interposer with other components. Such an attachment process would be a cause of unwanted performance deviation of MEMS or NEMS devices due to the packaging stress. Therefore, an FEM model has been used to evaluate deflection and stress of NEMS waveguides and microring resonators which are main elements for the proposed optical filter.