作为未来标准倒装芯片封装工艺的预置底填片材料的可靠性和工艺能力研究

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853170

H. Noro, M. Mizutani, M. Kuwamura, H. Usui, S. Ito

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引用次数: 4

摘要

倒装芯片的工艺技术是考虑封装可靠性、降低成本和量产稳定性的重要因素。提出了一种采用不导电底填树脂片的倒装芯片封装新工艺。这项新技术是无助焊剂倒装芯片封装技术，它消除了目前液体下填充树脂与点胶系统的助焊剂应用和清洗过程。与液体底灌配药工艺相比，它在简化包装工艺和降低操作难度方面具有很大的潜力。此外，由于该底填树脂片材引入了具有苯酚固化体系的环氧树脂，因此具有更高的防潮可靠性性能。本文研究了两种不导电底填料树脂片材封装工艺的工艺性能和可靠性。适当的下填料树脂成分和封装工艺，可获得较高的应力可靠性和生产率。

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Study of reliability and process ability for preset underfill sheet material as future standard flip chip packaging process

Process technology in flip chip assembly is an important factor in considering the package reliability, cost reduction and stability of mass production. A novel flip chip packaging technology using non-conductive underfill resin sheet was developed. This new technology is no-flux flip chip packaging technology which eliminates the flux applying and cleaning process in current liquid underfill resin with dispensing system. It has a lot of potential to make the packaging process simpler and reduce handling difficulty compared with liquid underfill dispensing process. Additionally, it makes moisture related reliability performance higher because this underfill resin sheet introduces an epoxy resin with phenol curing system. In this paper, we studied the process ability and reliability on two kinds of packaging processes with non-conductive underfill resin sheets. The higher stress reliability and productivity was shown with the proper underfill resin component and packaging process.

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来源期刊

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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