通过SIPI联合仿真和抖动传递函数确定系统级裕度

F. Tan, Li Wern Chew, L. L. Ong, Sze Lin Mak, Chee Hoong Mah
{"title":"通过SIPI联合仿真和抖动传递函数确定系统级裕度","authors":"F. Tan, Li Wern Chew, L. L. Ong, Sze Lin Mak, Chee Hoong Mah","doi":"10.1109/EPTC56328.2022.10013303","DOIUrl":null,"url":null,"abstract":"This paper investigates Signal Integrity - Power Integrity relationship using a dual reference package design and understanding high-speed interconnect circuit's behavior through Jitter Transfer Function. A dual referencing design and modeling approach is introduced to enable maximum noise coupling to differential signal traces. Simulation platform that allows a quick jitter assessment with power noise injection is then built to evaluate the risk of having dual referencing design. Using Peripheral Component Interconnect Express Gen5 interconnects as a case study, the findings shown that mid-frequency power noise matters most to differential interconnects, which turned out to be correlated to its Jitter Transfer Function.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Determining System Level Margin through SIPI Co-simulation and Jitter Transfer Function\",\"authors\":\"F. Tan, Li Wern Chew, L. L. Ong, Sze Lin Mak, Chee Hoong Mah\",\"doi\":\"10.1109/EPTC56328.2022.10013303\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper investigates Signal Integrity - Power Integrity relationship using a dual reference package design and understanding high-speed interconnect circuit's behavior through Jitter Transfer Function. A dual referencing design and modeling approach is introduced to enable maximum noise coupling to differential signal traces. Simulation platform that allows a quick jitter assessment with power noise injection is then built to evaluate the risk of having dual referencing design. Using Peripheral Component Interconnect Express Gen5 interconnects as a case study, the findings shown that mid-frequency power noise matters most to differential interconnects, which turned out to be correlated to its Jitter Transfer Function.\",\"PeriodicalId\":163034,\"journal\":{\"name\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC56328.2022.10013303\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013303","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文采用双参考封装设计来研究信号完整性和功率完整性的关系,并通过抖动传递函数来理解高速互连电路的行为。采用双参考设计和建模方法,使差分信号走线的噪声耦合达到最大。然后建立了一个仿真平台,允许快速抖动评估与功率噪声注入,以评估具有双重参考设计的风险。以Peripheral Component Interconnect Express Gen5互连为例,研究结果表明,中频功率噪声对差分互连影响最大,并与差分互连的抖动传递函数相关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Determining System Level Margin through SIPI Co-simulation and Jitter Transfer Function
This paper investigates Signal Integrity - Power Integrity relationship using a dual reference package design and understanding high-speed interconnect circuit's behavior through Jitter Transfer Function. A dual referencing design and modeling approach is introduced to enable maximum noise coupling to differential signal traces. Simulation platform that allows a quick jitter assessment with power noise injection is then built to evaluate the risk of having dual referencing design. Using Peripheral Component Interconnect Express Gen5 interconnects as a case study, the findings shown that mid-frequency power noise matters most to differential interconnects, which turned out to be correlated to its Jitter Transfer Function.
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