改进FinFET SoC设计中动态IR降信号的分析覆盖率

2020 International SoC Design Conference (ISOCC) Pub Date : 2020-10-21 DOI:10.1109/ISOCC50952.2020.9332987

Minji Lee, Changseok Choi, Donghyeon Seo, Byeongjun Bang, Yongseok Kang, Woohyun Paik

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引用次数: 3

摘要

电网设计是大型SoC设计的关键挑战之一。为了保证电网的鲁棒性，需要对动态红外降进行正确的分析。本文阐述了无矢量分析的缺点和基于矢量分析的必要性。我们已经改进了分析范围，以获得更准确的动态IR下降分析。分析结果采用FinFET技术节点，并在ANSYS RedHawk软件中进行仿真。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Improving Analysis Coverage for Dynamic IR Drop Sign-off in FinFET SoC Design

Power grid design is one of the key challenges in large SoC design. In order to guarantee robustness of the power grid, dynamic IR drop should be analyzed correctly. In this paper, we have described weakness of vectorless analysis and necessity of vector-based analysis. We have improved analysis coverage for the more accurate dynamic IR drop analysis. The analysis results were obtained with the FinFET technology node and all simulations were done in the ANSYS RedHawk.

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2020 International SoC Design Conference (ISOCC)

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