{"title":"BGA焊点波峰焊裂纹失效机理研究","authors":"Wen-li Wang, Yong-sheng Liang","doi":"10.1109/ICEPT.2007.4441517","DOIUrl":null,"url":null,"abstract":"This paper introduces the solder joints of BGA on PCB top side appearing crack phenomenon after the bottom side passed wave soldering, the reason for solder joints crack is that partial solder joints are dewetting on the component side IMC pad. Through many kinds of failure analysis method, the failure analysis conclusion is that BGA solder joints crack is due to the solder joints melting during wave soldering. The direct reason is that component side pad's coating is gold on nickel, but PCB side pad's coating is HASL finish, copper from PCB pad migrates across the BGA ball while the solder joint melt, thus Ni-Sn-Cu IMC is formed on the component side pad.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":" 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Study on Failure Mechanism of BGA Solder Joints Crack during Wave Soldering\",\"authors\":\"Wen-li Wang, Yong-sheng Liang\",\"doi\":\"10.1109/ICEPT.2007.4441517\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces the solder joints of BGA on PCB top side appearing crack phenomenon after the bottom side passed wave soldering, the reason for solder joints crack is that partial solder joints are dewetting on the component side IMC pad. Through many kinds of failure analysis method, the failure analysis conclusion is that BGA solder joints crack is due to the solder joints melting during wave soldering. The direct reason is that component side pad's coating is gold on nickel, but PCB side pad's coating is HASL finish, copper from PCB pad migrates across the BGA ball while the solder joint melt, thus Ni-Sn-Cu IMC is formed on the component side pad.\",\"PeriodicalId\":325619,\"journal\":{\"name\":\"2007 8th International Conference on Electronic Packaging Technology\",\"volume\":\" 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 8th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2007.4441517\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2007.4441517","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study on Failure Mechanism of BGA Solder Joints Crack during Wave Soldering
This paper introduces the solder joints of BGA on PCB top side appearing crack phenomenon after the bottom side passed wave soldering, the reason for solder joints crack is that partial solder joints are dewetting on the component side IMC pad. Through many kinds of failure analysis method, the failure analysis conclusion is that BGA solder joints crack is due to the solder joints melting during wave soldering. The direct reason is that component side pad's coating is gold on nickel, but PCB side pad's coating is HASL finish, copper from PCB pad migrates across the BGA ball while the solder joint melt, thus Ni-Sn-Cu IMC is formed on the component side pad.
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