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集成光学器件的室温直接键合

LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings Pub Date : 2008-09-26 DOI:10.1109/INOW.2008.4634511
R. Takei, K. Abe, T. Mizumoto
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引用次数: 3

摘要

我们报道了一种室温直接键合技术，用于InP-Ce:YIG, Si-InP和Si-LiNbO3的晶圆组合。这种技术对于集成由不同晶体组成的光学器件是通用的。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Room-Temperature Direct Bonding for Integrated Optical Devices
We report a room-temperature direct bonding technique for wafer combinations of InP-Ce:YIG, Si-InP and Si-LiNbO3. This technique is versatile for integrating optical devices that are composed of different crystals.
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LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings
LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings
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