大规模集成电路和超大规模集成电路器件的精密截面分析

Peter G. Angelides
{"title":"大规模集成电路和超大规模集成电路器件的精密截面分析","authors":"Peter G. Angelides","doi":"10.1109/IRPS.1981.362985","DOIUrl":null,"url":null,"abstract":"This is a tutorial paper describing and illustrating a crosssectional procedure for LSI and VLSI devices. The significant results using this procedure are one to one measurements of circuit parameters and a very clear view of the crosssectioned circuit at any given point. It is thus possible to measure with ease dimensions in the 0.3 micron range using the light microscope.","PeriodicalId":376954,"journal":{"name":"19th International Reliability Physics Symposium","volume":"23 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1981-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Precision Crosssectional Analysis of LSI and VLSI Devices\",\"authors\":\"Peter G. Angelides\",\"doi\":\"10.1109/IRPS.1981.362985\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This is a tutorial paper describing and illustrating a crosssectional procedure for LSI and VLSI devices. The significant results using this procedure are one to one measurements of circuit parameters and a very clear view of the crosssectioned circuit at any given point. It is thus possible to measure with ease dimensions in the 0.3 micron range using the light microscope.\",\"PeriodicalId\":376954,\"journal\":{\"name\":\"19th International Reliability Physics Symposium\",\"volume\":\"23 5\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1981-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1981.362985\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1981.362985","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

这是一篇描述和说明大规模集成电路和超大规模集成电路器件的横截面程序的教程。使用此程序的重要结果是电路参数的一对一测量和在任何给定点的截面电路的非常清晰的视图。因此,使用光学显微镜可以轻松测量0.3微米范围内的尺寸。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Precision Crosssectional Analysis of LSI and VLSI Devices
This is a tutorial paper describing and illustrating a crosssectional procedure for LSI and VLSI devices. The significant results using this procedure are one to one measurements of circuit parameters and a very clear view of the crosssectioned circuit at any given point. It is thus possible to measure with ease dimensions in the 0.3 micron range using the light microscope.
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