瞬态TCAD仿真研究负电容finfet的前景

H. Ota, K. Fukuda, T. Ikegami, J. Hattori, H. Asai, S. Migita, A. Toriumi
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引用次数: 20

摘要

采用一种新的瞬态TCAD模拟方法,对金属(M) /铁电(F) /金属(M) /绝缘体(I) /半导体(S)结构中负电容(NC)状态的稳定性和不稳定性进行了严格研究,其中考虑了随时间变化的Landau-Khalatnikov (LK)方程。我们的瞬态分析表明,由于反转层的形成,NC变得不稳定,并且在NC状态下产生滞后,这是稳态仿真无法模拟的。我们提出了一种新的FinFET,其中f层位于栅极接触孔,并采用实验获得的(Hf, Zr)O2的铁电参数展示了避免nc态不稳定的设计准则。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Perspective of negative capacitance FinFETs investigated by transient TCAD simulation
Stability and instability of the negative capacitance (NC) states in metal (M) / ferroelectric (F) /M /insulator (I) /semiconductor (S) structures are rigorously studied using a newly developed transient TCAD simulation, in which time-dependent Landau-Khalatnikov (LK) equation can be considered. Our transient analysis reveals that NC becomes unstable due to formation of the inversion layer and gives rise to hysteresis in the NC-state, which cannot be simulated by the steady simulation. We propose a novel FinFET, in which the F-layer is located at the gate contact holes and exhibit a design guideline to avoid the instability of the NC-state using experimentally obtained ferroelectric parameters for (Hf, Zr)O2.
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