M. Siesicki, K. Nieweglowski, K. Wolter, S. Patela
{"title":"光电PCB集成光波导","authors":"M. Siesicki, K. Nieweglowski, K. Wolter, S. Patela","doi":"10.1109/STYSW.2008.5164148","DOIUrl":null,"url":null,"abstract":"In this paper a novel method for design, development and fabrication of low attenuation waveguides is describe in details. Different sol-gel materials and coating methods are presented. The most critical processing step by manufacturing of integrated interconnects is a coating of a lower cladding on structured copper surfaces. Therefore a suitable material and coating method was founded, which enable realizing of cladding layer with required parameters. For evaluation of fabricated waveguides the attenuation measurement was used.","PeriodicalId":206334,"journal":{"name":"2008 International Students and Young Scientists Workshop - Photonics and Microsystems","volume":"84 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Integrated optical waveguides for electrooptical PCB\",\"authors\":\"M. Siesicki, K. Nieweglowski, K. Wolter, S. Patela\",\"doi\":\"10.1109/STYSW.2008.5164148\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper a novel method for design, development and fabrication of low attenuation waveguides is describe in details. Different sol-gel materials and coating methods are presented. The most critical processing step by manufacturing of integrated interconnects is a coating of a lower cladding on structured copper surfaces. Therefore a suitable material and coating method was founded, which enable realizing of cladding layer with required parameters. For evaluation of fabricated waveguides the attenuation measurement was used.\",\"PeriodicalId\":206334,\"journal\":{\"name\":\"2008 International Students and Young Scientists Workshop - Photonics and Microsystems\",\"volume\":\"84 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-06-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Students and Young Scientists Workshop - Photonics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STYSW.2008.5164148\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Students and Young Scientists Workshop - Photonics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STYSW.2008.5164148","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrated optical waveguides for electrooptical PCB
In this paper a novel method for design, development and fabrication of low attenuation waveguides is describe in details. Different sol-gel materials and coating methods are presented. The most critical processing step by manufacturing of integrated interconnects is a coating of a lower cladding on structured copper surfaces. Therefore a suitable material and coating method was founded, which enable realizing of cladding layer with required parameters. For evaluation of fabricated waveguides the attenuation measurement was used.