氧化物对降低Al/ Oxide /n-GaN MIS器件接触电阻率的影响

J. Koba, J. Koike
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引用次数: 0

摘要

我们用$\mathbf{GaO}_{\mathrm{x}},\mathbf{TiO}_{\mathrm{x}}$和$\mathbf{ZnO}_{\mathrm{x}}$在Si掺杂浓度为$\boldsymbol{2\times 10}^{18} \mathbf{cm}^{-3}$的n- GaN上研究了金属-绝缘体-半导体(MIS)的接触。而与$\mathbf{GaO}_{\mathrm{x}}$相比,$\boldsymbol{7.1\times 10^{-7}\Omega}\cdot \mathbf{cm}^{2}$的比接触电阻率较低$(\boldsymbol{\rho}_{c})$,与$\mathbf{ZnO}_{\mathrm{x}}$相比,$\mathbf{TiO}_{\mathrm{x},}\rho_c$的比接触电阻率较低$\boldsymbol{7.7\times 10}^{-5}$ Ω·cm2。我们进一步评估了氧化物/GaN的能带排列,并讨论了基于金属诱导隙态(MIGS)模型的肖特基势垒高度(SBH)的变化,以验证我们的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Oxide Species on the Reduction of Contact Resistivity of Al/oxide/n-GaN MIS Devices
We investigated metal-insulator-semiconductor (MIS) contact using $\mathbf{GaO}_{\mathrm{x}},\mathbf{TiO}_{\mathrm{x}}$, and $\mathbf{ZnO}_{\mathrm{x}}$ on n- GaN having Si doping concentration of $\boldsymbol{2\times 10}^{18} \mathbf{cm}^{-3}$. While we obtained the low specific contact resistivity $(\boldsymbol{\rho}_{c})$ of $\boldsymbol{7.1\times 10^{-7}\Omega}\cdot \mathbf{cm}^{2}$ with $\mathbf{GaO}_{\mathrm{x}}$ and $\boldsymbol{7.7\times 10}^{-5}$ Ω·cm2 with $\mathbf{TiO}_{\mathrm{x},}\rho_c$ increased with $\mathbf{ZnO}_{\mathrm{x}}$. We further evaluated the band alignment of oxide/GaN and discussed the variation of the Schottky barrier height (SBH) based on the metal-induced gap states (MIGS) model to validate our results.
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