采用45nm CMOS SOI技术的全集成ka波段堆叠功率放大器

Jing-Hwa Chen, S. Helmi, S. Mohammadi
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引用次数: 6

摘要

一个完全集成的ka波段功率放大器(PA)设计了2个堆叠的Cascode单元,采用45nm CMOS SOI技术实现。堆栈配置克服了缩放晶体管的低击穿电压,并提供接近50 Ω的输出阻抗。在37 GHz时,当偏置为3.6 V时,PA的饱和输出功率(PSAT)和-1dB压缩输出功率(P1dB)分别为20.2 dBm和14.5 dBm,峰值PAE为11.2%。当电源电压提高到4.4 V(每个晶体管之间为1.1 V)时,PSAT和P1dB分别增加到21.4 dBm (140 mW)和17.5 dBm。尽管每个晶体管在低漏源电压下偏置,但堆叠配置允许PA在毫米波频率下提供高输出功率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A fully-integrated Ka-band stacked power amplifier in 45nm CMOS SOI technology
A fully-integrated Ka-band power amplifier (PA) designed with 2 stacked Cascode cells is implemented in 45nm CMOS SOI technology. The stack configuration overcomes the low breakdown voltages of scaled transistors and provides an output impedance close to 50 Ω. At 37 GHz, and when biased at 3.6 V, the PA delivers a saturated output power (PSAT) and a -1dB compressed output power (P1dB) of 20.2 dBm and 14.5 dBm, respectively, with a peak PAE of 11.2%. With a higher supply voltage of 4.4 V (1.1 V across each transistor), the PSAT and P1dB increase to 21.4 dBm (140 mW) and 17.5 dBm, respectively. The stack configuration allows the PA to deliver high output power at mm-wave frequencies despite the fact that each transistor is biased under a low drain-source voltage.
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