一种生产已知质量模具的磨损和测试工艺的开发

L. Prokopchak, J. Wrenn
{"title":"一种生产已知质量模具的磨损和测试工艺的开发","authors":"L. Prokopchak, J. Wrenn","doi":"10.1109/ICMCM.1994.753524","DOIUrl":null,"url":null,"abstract":"Multichip modules(MCMs) are a major growth market in the IC industry. However, a problem hindering the widespread use of MCM technology is the inability of the MCM manufacturer to obtain bare die with the same level of reliability as those die in packaged devices. If the MCM is determined to be faulty after burn-in and test, it is difficult and expensive to repair. In fact, it can be difficult to isolate the individual chips during bum-in at the module level, making the task of determining the failing chip more laborious. One contributing factor to these failures is the lack of burn-in of the die before the MCM is assembled. If every chip on an 8-chip module has a 4% probability of failing(common for state-of-the-art devices), the module has a 28% chance of failing. This calculation is derived from the equation Pp = (l-P(f))\" where; P = probability, p = passing, f = failing, and n = number of die per module. The goal is to deliver to the user known-good-die (KGD) with the same level of electrical test and burn-in reliability as currently available at the package level.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Development of a Burn-in and Test Process for Producing Known-Good-Die\",\"authors\":\"L. Prokopchak, J. Wrenn\",\"doi\":\"10.1109/ICMCM.1994.753524\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Multichip modules(MCMs) are a major growth market in the IC industry. However, a problem hindering the widespread use of MCM technology is the inability of the MCM manufacturer to obtain bare die with the same level of reliability as those die in packaged devices. If the MCM is determined to be faulty after burn-in and test, it is difficult and expensive to repair. In fact, it can be difficult to isolate the individual chips during bum-in at the module level, making the task of determining the failing chip more laborious. One contributing factor to these failures is the lack of burn-in of the die before the MCM is assembled. If every chip on an 8-chip module has a 4% probability of failing(common for state-of-the-art devices), the module has a 28% chance of failing. This calculation is derived from the equation Pp = (l-P(f))\\\" where; P = probability, p = passing, f = failing, and n = number of die per module. The goal is to deliver to the user known-good-die (KGD) with the same level of electrical test and burn-in reliability as currently available at the package level.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753524\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753524","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

多芯片模块(mcm)是集成电路行业的一个主要增长市场。然而,阻碍MCM技术广泛应用的一个问题是,MCM制造商无法获得与封装器件中那些芯片具有相同可靠性水平的裸晶片。如果MCM经过老化和测试后被确定为故障,则维修困难且费用昂贵。事实上,在模块级别上,在热插拔期间隔离单个芯片可能很困难,这使得确定故障芯片的任务更加费力。造成这些失败的一个因素是在MCM组装之前模具缺乏老化。如果一个8芯片模块上的每个芯片都有4%的故障概率(对于最先进的设备来说很常见),那么该模块有28%的故障概率。该计算由等式Pp = (l-P(f))”推导而来,其中;P =概率,P =通过,f =失败,n =每个模块的骰子数量。其目标是向用户提供具有与当前封装级别相同水平的电气测试和老化可靠性的已知好模具(KGD)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of a Burn-in and Test Process for Producing Known-Good-Die
Multichip modules(MCMs) are a major growth market in the IC industry. However, a problem hindering the widespread use of MCM technology is the inability of the MCM manufacturer to obtain bare die with the same level of reliability as those die in packaged devices. If the MCM is determined to be faulty after burn-in and test, it is difficult and expensive to repair. In fact, it can be difficult to isolate the individual chips during bum-in at the module level, making the task of determining the failing chip more laborious. One contributing factor to these failures is the lack of burn-in of the die before the MCM is assembled. If every chip on an 8-chip module has a 4% probability of failing(common for state-of-the-art devices), the module has a 28% chance of failing. This calculation is derived from the equation Pp = (l-P(f))" where; P = probability, p = passing, f = failing, and n = number of die per module. The goal is to deliver to the user known-good-die (KGD) with the same level of electrical test and burn-in reliability as currently available at the package level.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信