高性能、低驱动电压的非晶InGaZnO薄膜晶体管,采用高通量HfSiO电介质

Hau-Yuan Huang, Yen-Chieh Huang, Je-Yi Su, N. Su, C. Chiang, Chien-Hung Wu, Shui-Jinn Wang
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引用次数: 2

摘要

采用射频溅射的方法,以非晶铟镓氧化锌(α-IGZO)为通道,高通量材料HfSiO为栅极介质制备了薄膜晶体管。研究了高温PDA温度变化对器件特性的影响。底栅低压驱动(≤2 V) TFTs工作在n型增强模式下,场效应迁移率为12.7cm2/V-s,通断电流比为3×105,阈值电压为0.005V,亚阈值电压摆幅为0.11V/dec。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High performance and low driving voltage amorphous InGaZnO thin-film transistors using high-к HfSiO dielectrics
Thin-film transistors were fabricated using amorphous indium gallium zinc oxide (α-IGZO) as channels and high-к material HfSiO as gate dielectric by RF sputtering. The influence of high-к PDA temperature variation on device characteristics was investigated. The bottom-gate low voltage driven (≤ 2 V) TFTs operated in n-type enhancement mode with a field-effect mobility of 12.7cm2/V-s, on-off current ratio of 3×105, threshold voltage of 0.005V, and subthreshold voltage swing of 0.11V/dec.
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